Flowcode V5 Crack Serial 113 __TOP__
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Due to their desirable properties, a number of chemistries have been investigated for producing polyimides. Polyimide coatings have been applied to silicon surfaces to adhere the silicon device to a metal substrate. However, polyimide has problems of adhesion to silicon and silicon dioxide. Additionally, polyimide coatings have been applied to non-silicon surfaces to adhere the non-silicon device to a substrate. However, polyimide coatings have problems of adhesion, or the bond between the coated surface and a substrate to which the coated surface is to be adhered. For example, polyimide coatings have generally been poor in adhering to polymeric materials used as interlevel dielectrics, such as crosslinked polyvinyl siloxanes, as well as other substrates having exposed surfaces. Other problems with polyimides include delamination of the protective polyimide coating from the device and the substrate.
In other polymers, these problems have been avoided by the use of adhesion promoting layers between the polyimide protective layer and the substrate. For example, adhesion promoting layers are commonly applied to the polyimide protective layer before applying the polyimide protective layer to a substrate. In the case of silicon, a silicon dioxide layer is typically applied to a silicon substrate as an adhesion promoting layer. In the case of a non-silicon substrate, an adhesion promoting layer is applied to the substrate before application of the polyimide protective coating.
Applying adhesion promoting layers to the substrate, the polyimide protective layer and the treated surface of the polyimide protective layer have several problems. For example, adding additional steps to the manufacturing process is a concern. In addition, various problems can result, such as chemical
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